Electrodeposition Assisted X-ray Lithography: Single Step Approach

Abstract

This paper reports on the development of a novel single-step approach for the formation of patterned metal deposits using X-ray lithography. It is based on simultaneously exposing the substrate to masked X-rays within an electric field, utilizing the effects of radiolysis and potentiostatic electrodeposition. In the LIGA process a thick photo resist is exposed to a masked off X-ray beam and the processed resist is used as an electroplating template. Minimization of as many processing steps as possible would make the process a much more efficient and cost effective technique. The traditional molding and electroplating steps were marked for deletion in our proof of concept experiment, because of the beam time and effort that is required in manufacturing a LIGA mold. The method that is presented forgoes 4 traditional steps involved in fabricating high aspect ratio structures. We provide a proof of principle for single step patterning with x-ray lithography.