Abstract
Anisotropic conductive adhesives (ACAs) have been considered as one of promising interconnect materials for next generation high performance devices. However, high joint resistance and low current carrying capability of ACA joints have been a bottleneck to deploy ACAs in high power devices. In this study, we introduced conjugated dithiols into ACA formulations to construct the molecular wire junction between conductive fillers and metal pads to facilitate the electron transport through the joint. With introduction of molecular wires, the electrical conductivity and current carrying capability were significantly improved. The factors that lead to the improved electrical properties were discussed.
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