Abstract
The paper presents a design of On-chip antennas for wireless inter-chip communication integrated on symmetric layers. The proposed symmetrical layers cancel the destructive multipath interference encountered due to the wave propagation between the transmitting and receiving antenna. The structure is simulated for two linear dipole antennas spaced 2 cm on a silicon substrate. Results show a 10 dB improvement in the overall transmission gain for the symmetrical layered structure over the unsymmetrical one. This study provides the feasibility of using the proposed symmetrical layered structure for inter-chip and chip-to-chip wireless communications.
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