Abstract
In this study, the junction temperature (Tj) and thermal resistance (Rth) of five high-power multi-chip COB (chip-on-board) LED packages with different chip spacings were compared. The actual Tj was measured by an IR camera and compared with the simulation results from a computational fluid dynamics (CFD) software. In addition, the effects of heat slugs with different thermal conductivity, heat sinks of various thicknesses, chip size, and forced convection cooling on the Tj and Rth of high-powered LED components were investigated. The experimental results show that smaller chip spacing resulted in higher Tj and Rth. The heat dissipation performance can be improved by using a heat slug with a high thermal conductivity; and increasing the thickness of the heat sink, or employing forced convection cooling.
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