Abstract
We numerically performs structural engineering for lowering interfacial recombination, and enhancing efficiency of CZTS solar cells. Structural modification of controlling carrier density profile at CZTS/CdS interfaces, CZTS absorber surface region carrier density, CZTS surface region bandgap modification, Fermi level pining and tunneling at the CZTS/CdS junction are studied for their impact device performance. We observed that the lowering hole concentration and widening bandgap of CZTS in vicinity of CZTS/CdS junction, lower interface recombination and improve performance. Fermi level pinning near to conduction band edge at CZTS/CdS interface showed lower recombination as compared to the case where Fermi level is pinned at midgap at CZTS/CdS interface. The donor defects from buffer layer pins the Fermi level near conduction band and acceptor defect from absorber CZTS layer pins Fermi level near mid gap at CZTS/CdS interface. Intra band tunneling through high conduction band offset barrier maintain performance for up to 0.5 eV spike barrier. High hole density profile at CZTS/metal lower back contact interfacial recombination. These structural engineering numerical performed here, present bright aspect for improving efficiency of CZTS solar cells. • Device engineering is performed for controlling interfacial recombination in CZTS solar cells. • Absorber surface layer parameters such as carrier density profile and bangap influence interfacial recombination. • Fermi level pinning near conduction band edge is advantageous than Fermi level pinned at midgap at CZTS/CdS interface. • High majority carrier concentration near back contact in CZTS minimize the effect of high Schottky barrier and high SRV.
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