Abstract
η′-Cu6Sn5 is one of the main components of intermetallic compounds in the solder joint of electronic components. The research on improving its performance will help to solve the problem of increasing mechanical properties, electrical conductivity and thermal conductivity of solder joints of electronic devices. In this paper, we use the first-principles method to calculate the effects of 0.57 at.% and 1.14 at.% Zn doped on the Cu1, Cu2, Cu3 and Cu4 positions of η′-Cu6Sn5 on the mechanical and electronic properties of the structure. And we draw a 3D model to express the mechanical anisotropy of the doping system. The calculated results show that doping Zn makes η′-Cu6Sn5 more stable. However, the addition of Zn also reduces the fracture toughness of η′-Cu6Sn5, increases the anisotropy of η′-Cu6Sn5, and weakens the shear resistance of the solder joint of electronic devices.
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