Abstract
Three-dimensional (3D) NAND flash memory devices having a poly-silicon channel with grain boundaries, the cylindrical macaroni channel being outside the inter-oxide filler layer and inside the tunneling oxide layer, were evaluated. The effects of the grain size, grain boundary trap density, and interface trap density at the interfaces between the channel and the oxide layers on the electrical characteristics of 3D NAND flash memory devices were investigated. The electron density of the channel was changed depending on the grain boundary trap density and the position of the grain boundary trap in the channel. The grain boundary traps increased the potential barrier and decreased the electron density of the channel. The threshold voltage increased with increasing grain boundary trap density and interface trap density.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
