Abstract
The microstructure and shear property of Cu/In-50Ag-xCe/Cu (x = 0, 0.3, 0.6, 1.2, 2 wt%) composite solder joints fabricated by transient liquid phase (TLP) bonding were investigated. The results showed that the appropriate amount of Ce particles refined the microstructure in the Cu/In-50Ag/Cu solder joint, and inhibited Cu2In phase formation at the Cu/solder interface. The refined Ag2In phases contribute to suppressing the formation of microstructural defects. The Ce particles can improve the microstructure uniformity of composite solder joint, the porosity of Cu/In-50Ag-0.6Ce/Cu solder joint is only 1.05%, and the excessive (1.2–2 wt%) Ce particles are harmful to the composite solder joints. Doping 0.3–0.6 wt% Ce particles can improve the shear strength of composite solder joints by reducing microstructural defects, refining Ag2In phases and improving the phase boundaries strength. The maximum shear strength value of the Cu/In-50Ag-0.6Ce/Cu composite solder joint reaches 17.58 MPa. The fracture mechanism is mainly brittle fracture, which occurs near the in-situ reaction zone. The Cu/In-50Ag-0.6Ce/Cu composite solder joint fabricated by TLP bonding with finer microstructure and higher mechanical properties is acceptable.
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