Abstract
The effects of mold pattern characteristics on the mechanical deformation and mechanics of nanoimprinted aluminum are studied using quasi-continuum simulations in terms of atomic trajectories, strain distribution, and the imprinting stress-mold displacement curve. The simulation results show that a mold whose pattern has a larger period (S value) produces a larger imprinting stress on the substrate for deformation. The effect of mold taper angle on imprinting stress depends on the S value. The required imprinting stress for substrate deformation decreases when mold wear occurs, resulting in the appearance of more non-local atoms in the substrate because of a nonuniform stress distribution. The nucleation and propagation of dislocations in the substrate are significantly confined when the S value is very small (e.g., 150 Å).
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
