Abstract
High power light emitting diodes are currently challenged by thermal issue of high heat generation which limits the reliability and efficiency. Each component in the LED package has a significant role in heat dissipation. In this paper, a simulation study was done to scrutinize the influence of heat slug shape on the heat dissipation of single chip LED package using Ansys version 11. Two types of heat slug shapes, rectangular and cylindrical were used. The analysis was carried out under natural convection condition at ambient temperature of 25°C. Simulated results indicate that rectangular shape heat slug exhibits better heat dissipation.
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