Abstract
Hydrogen peroxide is widely used as an oxidizer in metal chemical mechanical planarization (CMP) slurry due to its strong oxidizing ability and being a non-metal product. However, hydrogen peroxide is unstable and easily decomposes into water and oxygen molecules. In this experiment, the aging of a hydrogen peroxide-glycine-based Cu CMP slurry was investigated in terms of the chemical concentration and CMP performance. Ultraviolet–visible–near-infrared spectroscopy was used to measure the change of hydrogen peroxide concentration with slurry aging. As the slurry aging time was increased, the removal rate decreased for several reasons. With slurry aging, not only decreases of hydrogen peroxide concentration but also decreases of pH and glycine decomposition were observed. Therefore, the removal rate was suppressed due to complex factors, including the decreased oxidizing ability with decreased hydrogen peroxide concentration, decomposition of the glycine chelating agent, and decrease in pH. This study suggests the necessity of monitoring slurry aging and management for optimizing CMP process performance.
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