Abstract
An analysis is presented of polyimides (PIs) exposed to heat and humidity stress over long periods. Electron spectroscopy for chemical analysis (ESCA) and Fourier transform infrared (FTIR) spectroscopy were used to investigate the basic physical mechanisms that affect PI when stressed. The results show that changes are confined to a surface layer at the PI-air interface. ESCA data show significant changes at the PI-air interface and that the PI-Si interface remains unchanged. FTIR transmission data indicate that the bulk chemistry is unaffected by such exposure. The surface chemistry is characterized by a significant reduction in the pyromellitic dyanhydride (PMDA) moiety and changes in the bonding of oxygen. There appear to be changes in the imide structure for the PI surface, but the mechanisms of change require further study. This has reliability implications for microelectronic systems using PI as a dielectric. >
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