Abstract
We developed highly precise self-alignment process using resin materials for next generation microelectromechanical systems (MEMS), micro-opto-electro-mechanical systems (MOEMS) and optoelectronic multichip modules (OE-MCMs) applications. Although liquid resins have a characteristic as low as one tenth of the surface tension of solder in general, self-alignment capability could be achieved by using 3-D pads for positioning boundary. In this research, we propose the novel passive alignment mechanism in order to enhance understanding of alignment motion. Moreover, the influence of viscosity on alignment motion and alignment accuracy is demonstrated by scaled-up experiment. We could achieve highly precise alignment accuracy less than 0.4 μm.
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