Abstract
Methods of stripping voltammetry, quartz microgravimetry, and x-ray-fluorescence analysis are employed to explore the copper displacement process on thin electrodeposited layers of pure cobalt and nickel and on deposits of these metals with inclusions of copper. The displacement reaction proceeds at a considerable rate on cobalt in the sulfate and sulfosalicylate solutions and virtually does not proceed on nickel in both the sulfate or sulfate-chloride solutions. An estimate of the rate of the copper displacement reaction following a change in the concentration of copper ions in the solution and in the pH of the sulfosalicylate solution is given. A decrease in the contact exchange rate is facilitated by a decrease in the concentration of copper ions in solution and their participation in the formation of complexes.
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