Abstract
The effect of surface bond-order loss on the electronic thermal conductivity of metallic polycrystalline films is examined using Boltzmann transport theory. A modification of the grain boundary potential barrier has been made by adding depressed potential wells of intra-atomic trapping [C. Q. Sun, Phys. Rev. B 69, 045105 (2004)] to both sides of the grain boundaries. Electron scattering by film surfaces is also considered to follow the line of Fuchs’ convention. Results show that the thermal conductivity of the films is sensitive to the film thickness, mean grain size, and Fermi energy. In particular, thermal conductivity increases significantly with the depth of the atomic trapping due to the bond-order loss induced surface bond contraction and associated bond strength gain.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
