Abstract

The electronics industry has been moving towards lead-free solders since 2006; Sn96.5 Ag3.0 Cu0.5 (SAC305) and Sn96.5 Ag1.0 Cu0.5 ( SAC105) have been the popular solder alloys in the industry. The reliability of such alloys is an issue for thermal applications in long-term use. In this paper, the effect of different combination of solder pastes, solder sphere alloys and surface finishes are studied. The test vehicle consists of 15mm and 6mm Ball Grid Array (BGA) components, 5mm Quad Flat No-lead (QFN) packages and 2512 Surface Mount Resistors (SMR). The test vehicles were assembled using different solder pastes onto a 6 layer printed circuit boards. The boards are isothermally aged boards at 125°C for 12 months are thermally cycled between −40°C to +125°C. Since there were not many failures for 6mm BGAs, QFNs and SMRs, only data regarding 15mm BGAs were used in the study. Two-parameter Weibull analysis is used to analyze the failure data and observe the life degradation of the solder joints based on different factors such as solder pastes, solder sphere alloys and surface finishes. It was observed that in most cases, the same surface finish and the same solder sphere alloy performed better than others.

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