Abstract
When a handheld device is subjected to a drop impact, the out-of-plane deformation of printed circuit board (PCB) is a major concern to manufacturers as it is directly proportional to the stress which causes failure for the solder joints. The shield-can attached to the PCB can provide additional mechanical strength and minimize the out-of-plane deformation. In this work, board level drop test is conducted with instrumentation following the Joint Electron Device Engineering Council (JEDEC) test standards. A non-contact full field optical measurement technique, Digital Image Correlation (DIC), is applied to monitor and document the dynamic responses of PCB during the drop test. Different shield-can type varying in shape and size are attached to the PCB through frame or clip type connection. The effects of these two connecting methods, as well as the shape and size of shield-can, on the dynamic responses of PCB are analyzed experimentally. Along with board level drop experiments, a detailed 3D FEA model has been developed to verify and analyze the dynamic responses of PCB using ANSYS/LS-DYNATM. Several simulations have been performed to verify experimental results. Different contact techniques, such as Nodes merge and Tied Nodes to Surface (TDNS) contact have been applied as boundary conditions to connect shield-can with PCB and a proper representation of connection is found in the simulation.
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