Abstract
In this study, monocrystalline p-type Czochralski silicon wafers having dimension 127 × 127 mm2, thickness 200 μm, and plane (100) were textured to optimize the surface reflection for the fabrication of efficient solar cell. Properly cleaned silicon wafers were textured with the systematic variation of the etching time and chemical concentration (KOH and IPA) at 70 °C temperature. According to field emission scanning electron microscope (FESEM) images and surface reflection measurement (SRM) data, the wafer textured with 10 min etching time and the wafer textured with 1 g of KOH concentration, both showed the similar minimum optical reflectance of 15.08%. This lower reflectance was due to the formation of uniform pyramidal structure on the wafer surface. Moreover, the wafer surface textured with 7 ml isopropyl alcohol (IPA) showed the lowest surface reflectance of 13.59% because of the formation of more uniform pyramidal structure. The most effective pyramidal structure for fabricating efficient solar cell was found for 10 min etching with optimum chemical recipe of KOH: IPA: H2O = 1 g: 7 ml: 125 ml.
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