Abstract

The effect of pulsed electrolysis on the electrodeposition of Cu–Sn alloy from the sulfate–sulfuric acid electrolyte is studied. It is shown that the codeposition of copper and tin is observed only at the potentials, which provide the discharge of copper(II) ions under the diffusion control. The transient time of electroreduction of copper(II) ions and the concentrations of Cu2+ ions in the near-cathode region in the pause are calculated. It is shown that a decrease of the pause duration leads to the alloy deposition at lower current densities. It is found that the use of pulsed electrolysis enables one to raise significantly (by 3 times) the range of cathodic current densities for production of high-quality yellow-bronze coatings. The effect of pulse duration and amplitude on the qualitative and quantitative compositions of the alloy is determined.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.