Abstract
In this study, 200-mm blanket copper wafers were polished on an IC1010 M-groove pad, which was conditioned by a 3M A2810 disc and Mitsubishi Materials Corporation (MMC) TRD disc. Pad surface contact area and topography were analyzed using laser confocal microscopy and scanning electron microscopy. The MMC TRD disc generated a lot of large near contact areas corresponding to fractured and collapsed pore walls. The fractured and collapsed pore walls partly covered the adjacent pores, making the pad surface more lubricated during wafer polishing and rendering significantly lower coefficient of friction and removal rate than the 3M A2810 disc.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
