Abstract
As an effective application of neutral beam etching (NBE) to microelectromechanical systems (MEMS), here we propose a combination of conventional plasma processes and NBE to remove plasma-induced damage. To evaluate the effect of the combined approach quantitatively, we measured the resonance properties of a microcantilever before and after NBE treatment and compared them with a characteristic quantity. The thickness of the damage layer times the imaginary part of the complex Young's modulus (δEds), which is a parameter of surface damage. Although a plasma process makes the damaged surface of the microcantilevers during their fabrication, the removal of that damage by NBE is confirmed as a reduction in δEds. NBE can provide a damage-free surface for MEMS devices without a high-temperature annealing process.
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Schedule a callMore From: Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
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