Abstract
The injection molding process of micro plate devices requires several concerns in order to produce a quality output. In part of determining the best parameter settings, among other considerations that need to be taken are the types of plastic materials selected and the mold design. Molding parameters such as packing time, cooling temperature, molding and melting temperatures, packing and injection pressures are the most important factors affecting warpage of the micro plate part. These factors and their interactions were investigated in this research. The effects of processing parameter on the warpage of flat micro devices were analyzed according to the Taguchi method. In this paper, based on the range analysis, the parameter effective sequence was got, as well as the best processing parameters. The molding packing time has the strongest effects on the warpage, and the molding temperature is the secondary parameter. The cooling time has the lowest effects.
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