Abstract
The role of K2S2O8 (KPS) initiator on the material removal rate (MRR) of hard disk substrate in the H2O2-based slurry was investigated. Experiment results indicate that the MRR of slurry containing KPS and H2O2 is higher than that of slurry containing only H2O2 under the same testing conditions. The electrochemical test shows that KPS can increase the corrosion rate of hard disk substrate in the H2O2-based slurry. The electron spin-resonance spectroscopy (EPR) analysis shows that KPS, as an initiator, can increase the number of OH• free radical. Further, the reaction mechanism of KPS in abrasive-free polishing of hard disk substrate is discussed.
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