Effect of isothermal process parameters on semi-solid microstructure of chip-based Al–Cu–Mn–Ti alloy prepared by SIMA method

Abstract

A typical Al–Cu–Mn–Ti aluminum alloy chip was adopted to prepare semi-solid billets by a Strain-Induced Melt Activation (SIMA) method, and the effects of isothermal process parameters on the semi-solid microstructure evolution of the alloy were investigated in this work. The result showed that semi-solid billets with highly spheroidal and homogeneous fine grains could be prepared from chips by the SIMA method. With the increase of isothermal temperature, the finer and near-spherical grains are obtained, the grains coarsen and became ellipse at 903 K because of the coarsening mechanisms of coalescence and Ostwald ripening. The relationship of isothermal holding time and grains size followed the LSW theory well, and more spherical microstructure can be brought by prolonging the holding time until 3000 s. Thus, the optimal isothermal treatment temperature is 893 K and holding time is 3000 s, the corresponding average size and roundness of grains are 137 [Formula: see text]m and 1.108, respectively.