Abstract
The microstructural formation and properties of Sn-2.5Bi−xIn-1Zn-0.3Ag (in wt%) alloys and the evolution of soldered interfaces on a Cu substrate were investigated. Apart from the relatively low melting point (about 195°C), which is close to that of conventional eutectic Sn-Pb solder, the investigated solder presents superior wettability, solderability, and ductility. The refined equiaxial grains enhance the mechanical properties, and the embedded bulk intermetallic compounds (IMCs) (Cu6Sn5 and Cu5Zn8) and granular Bi particles improve the joint reliability. The addition of In reduces the solubility of Zn in the β-Sn matrix and strongly influences the separation and growth behaviors of the IMCs. The soldered interface of Sn-2.5Bi-xIn-1Zn-0.3Ag/Cu consists of Cu-Zn and Cu-Sn IMC layers.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: International Journal of Minerals, Metallurgy, and Materials
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
