Abstract
In this work, the correlation between SiO2 deposition thickness and hydrogen content is discussed and the effect of the SiO2 layer on the properties of synaptic InGaZnO (IGZO) TFTs is analyzed. Three types of IGZO synaptic thin-film transistors (TFTs) were fabricated with different gate insulators, and the effect of SiO2 as a gate insulator was investigated. XPS analysis confirmed that the hydrogen content in the Al2O3 and SiO2 layers increased during SiO2 deposition step for all depth regions. Hydrogen injected by the SiO2 layer deposition step was confirmed to improve the memory window through more threshold voltage shift under positive bias stress (PBS) and negative bias stress (NBS) conditions. In addition, the retention characteristics were improved due to the low hydrogen movement velocity in the SiO2 layer. These results contribute to the optimization of the amount of hydrogen, and the proposed device has potential as a synaptic device capable of neuromorphic computing.
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