Abstract
Four types of loading waveforms were adopted to investigate the effect of hold time on crack growth behavior of Sn-37Pb and Sn-3.0Ag-0.5Cu solders: a sinusoidal waveform, triangular waveform, and trapezoidal waveform with hold times of 1 s, 5 s, and 10 s, and a triangular waveform with hold time of 10 s at maximum tensile load. The experimental results showed that the crack growth behavior of both solders tested under sinusoidal and triangular waveforms without any hold time was predominantly cycle dependent. On the other hand, the crack growth behavior of both solders tested under trapezoidal waveforms with hold times of 1 s, 5 s, and 10 s and triangular waveforms with hold time of 10 s was predominantly time dependent. Under cycle-dependent conditions the crack growth data were a function of J-integral range, while under time-dependent conditions the crack growth data were not a function of the creep J-integral range but rather of the C* parameter.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
