Effect of dentine smear layer on the performance of self‐etching adhesive systems: A micro‐tensile bond strength study

Abstract

This study aimed to evaluate the effect of the smear layer on the micro-tensile bond strength when two self-etching adhesives were used with different techniques. Flat dentine surfaces were prepared using either medium grit diamond burs or tungsten carbide burs. Ten specimens from each prepared surfaces were subjected for smear layer evaluation under SEM. Forty specimens from each of the prepared surfaces were further divided into two groups, bonded with either Clearfil SE Bond (SE) or Clearfil S(3) Bond (S3) using one of four applications (as manufacturer's instructions, agitation, reapplication, and increased application time), restored with composites and subjected to a micro-tensile bond strength test. Smear layers created with diamond burs were thicker than those created with tungsten carbide burs. Surfaces prepared with tungsten carbide burs produced a higher bond strength than those prepared with diamond burs and the same type of adhesive resin. SE demonstrated a higher bond strength than S3 for all surfaces. S3 applied with the agitation technique demonstrated a higher bond strength to dentine prepared with tungsten carbide and diamond burs than that applied with other techniques. SE applied with increased time on dentine treated with carbide burs produced the highest bond strength. In conclusion, a thick smear layer decreased bond strength to dentine, and this might be improved by modification of application technique.