Abstract

This study aims to enhance the dimensional stability of alumina dispersion strength copper alloy via creep annealing treatment. The microstructure, residual stress and micro-yield strength of alloys after different treatments were investigated. During creep annealing, the residual stress in the alloy was dramatically reduced due to the decrease of dislocation density. The nano-Al2O3 particles in the alloy did not coarsen or agglomerate during the high temperature treatment and retarded the growth of subgrains effectively, which played important roles in high micro-yield strength of creep annealed alloy. The pores were effectively reduced by the creep deformation during creep annealing, resulting in a more uniform residual stress distribution and an increase in micro-yield strength. Compared with extruded alloy, the residual stress of alloy creep annealed at 950 °C for 12 h was reduced by 88%, while the micro-yield strength increased by 9.7%, leading to a significant enhancement in dimensional stability of the alloy.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.