Abstract
The experimental study of the mosaic type Mg/Cu diffusion couple in the argon protection environment was carried out. The microstructure and micro-hardness of the Mg/Cu diffusion layer were analyzed by means of SEM, EDS and micro-hardness tester. The results show that the diffusion behavior of Mg/Cu diffusion couple is influenced by annealing temperature. When the temperature located at 430~450�� , the behavior of element diffusion happened in solid phase, the thickness of diffusion layer increased slowly which was about 5~25um, and the microstructure of diffusion layer from Mg to Copper includes magnesium based solid solution /Mg2Cu/Cu2Mg/ copper based solid solution, the micro-hardness of the diffusion layer was significantly higher than that of the two sides, when bonded at 430�� for 4h, the micro-hardness of the diffusion layer was highest that up to 194HV. When the temperature reached to 485�� , the thickness of diffusion layer increased significantly which was about 5.3mm because of the formation of eutectic liquid phase reaction zone, and the microstructure of the diffusion layer were magnesium based solid solution /Mg-Cu eutectic/ Cu based solid solution.
Highlights
The research and application of Mg/Cu binary material has already extended from sailing to the military field, such as automobile, computer, communications equipment, and other civilian products with high added value, in order to reach the goal of weight loss and product multiplicity, it is necessary to weld the two metal materials [1,2,3]
Mg/Cu intermetallic compound can be formed at the interface of the joint after Mg/Cu diffusion bonding, which seriously affect the joint mechanical properties
The type and thickness of these intermetallic compounds are closely related to the Mg, Cu atom diffusion behavior[4,5]
Summary
The research and application of Mg/Cu binary material has already extended from sailing to the military field, such as automobile, computer, communications equipment, and other civilian products with high added value, in order to reach the goal of weight loss and product multiplicity, it is necessary to weld the two metal materials [1,2,3]. Mg/Cu intermetallic compound can be formed at the interface of the joint after Mg/Cu diffusion bonding, which seriously affect the joint mechanical properties. The type and thickness of these intermetallic compounds are closely related to the Mg, Cu atom diffusion behavior[4,5]. To discuss the influence of Mg/Cu atom diffusion behavior on interface diffusion layer growth mechanism and infer the generation and evolution law of the intermetallic compounds is of great importance to improve the quality of joint and understand the bonding process behavior. The experimental study of the "mosaic type" Mg/Cu diffusion couple in the argon protection environment was carried out. The microstructure and micro-hardness of the Mg/Cu diffusion layer were analyzed by means of SEM, EDS and micro-hardness tester
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