Abstract
AbstractDevice failures can be classified as event‐dependent, time‐dependent, and a combination of the two, event/time‐dependent failures. Early life failure are dominated by event‐dependent failures, i.e. Electrostatic Discharge (ESD) failures, and mechanical failures (bonds, cracks, etc.) that result from a stress event. Test and failure analysis results supporting the above are reviewed. This paper was presented at the 1985 Semiconductor Device Reliability NATO Workshop.
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