Abstract
ABSTRACTThermoelastic damping is a common phenomenon at room temperature in Micro Electro Mechanical Systems (MEMS). In this study, the behavior of electrostatically actuated curved microbeams is investigated, considering the effects of thermoelasticity. These devices have interesting applications as micro-mechanical memories. First, the equation of thermoelasticity is derived based on the generalized thermoelastic theory. Afterwards, this equation and the equation of curved beams vibrations are solved using the finite element method, simultaneously. Two common phenomena in MEMS, pull-in instability and snap-through buckling, have been investigated in this study, considering thermoelasticity and other design parameters.
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