Abstract
The crack–defect interaction mechanism was studied both experimentally and numerically. Experimental results found that the presence of empty hole before crack results in both the velocity and stress intensity factor of crack decrease. More energy accumulated at crack–hole tip before second initiation. Dynamic stress intensity factor is qualitatively in accord with Crack velocity, but it oscillates strongly with hole size increasing. Numerical study shows that the stress concentration would be reduced significantly when the modulus radio between the inclusion and the matrix is more than 0.5. Results may shed lights on the interaction behavior between running crack and inclusion.
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