Abstract
We demonstrated dual-surface modification of GaN/AlGaN/GaN high-electron mobility transistors using tetramethylammonium hydroxide (TMAH) and piranha solutions prior to gate metallization. The TMAH-treated device exhibits improved performances with lower I-V hysteresis, in off-state leakage current and gate leakage current. The device performances were further significantly improved with applies additional piranha solution treatment right after the TMAH treatment, especially in hysteresis and 1/f-noise characteristics. It is found that the Schottky barrier height is high and ideality factor is low measured from I-V characteristics for the TMAH and piranha solution treated device. Reasonable gate leakage mechanisms were also discussed using Poole–Frenkel and Schottky emissions. In addition, it is observed that the magnitude of interface state density for the TMAH treatment after the piranha solution treated device shows significantly low compared to other devices. These excellent device-performances are observed due to the reason of dual-surface treatment which effectively decreases the surface trap density with an appropriate etching and passivation of the device surface exposed prior to the gate metallization.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.