Abstract
The wafer direct bonding technique is very sensitive to surface adsorbed water; hence it is a useful way to characterize the impact of wafer drying. We have focused this work on the drying impact on surfaces after innovative solvent exposure, in a liquid or in a vapor phase, compared with standard isopropyl alcohol drying: we report characterization results from different techniques investigating both native and thermal oxide surfaces. We report promising drying through low surface tension solvent exposure, especially in a vapor phase.
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