Abstract
We have systematically investigated acceptor (Mg) and donor (Si) profiles at GaN tunnel junction interfaces with the aim of a low resistivity under reverse bias. We found that an overlap between Mg and Si at the tunnel junction interface was effective in helping to obtain a lower resistivity of the GaN tunnel junctions, which contradicts the typical picture of conventional semiconductor-based tunnel junctions. We demonstrated a LED with the GaN tunnel junction prepared in a single growth run by metalorganic vapor phase epitaxy, showing a differential resistivity of 2.4 × 10−4 Ω cm2 at 5 kA cm−2.
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