Abstract
A polyvinylidene fluoride (PVDF) film incorporating size-controlled, uniformly dispersed, directly patterned Bi2O3 nanoparticles was developed to achieve a high-k polymer nanocomposite capacitor. The photochemical metal-organic deposition (PMOD) method was employed to form uniformly dispersed and directly patterned nanoparticles on the substrate. Bi nanoparticles were produced by spin coating a Bismuth 2-ethylhexanoate solution on a Pt substrate with UV irradiation for 1, 4, 7, and 10 min. The average diameter of nanoparticles and the number of nanoparticles per unit area (μm2) were about 30, 70, and 120 nm and 30, 30, and 31 particles/μm2 for UV irradiation times of 4, 7, and 10 min, respectively. In addition, the capacitance of PVDF nanocomposite film could be controlled by the Bi2O3 nanoparticle size. The PVDF nanocomposite film containing Bi2O3 nanoparticles with 1, 4, 7, and 10 min UV irradiation were able to improve capacitance by about 1.4, 2.0, 2.7, and 3.4 times compared with an as-prepared PVDF film. By using a mask aligner, directly pattered Bi nanoparticles on the substrate, which had a 5 μm line width pattern, were successfully defined and demonstrated.
Highlights
Miniaturization of electronic devices is the trend to manufacture ever smaller mechanical, electronic and optical products and devices
This study used UV irradiation time as the control factor to tune the nanoparticle size, and Figure 2 shows SEM images of bismuth nanoparticles according to UV irradiation time
This study successfully demonstrated a polyvinylidene fluoride (PVDF) nanocomposite capacitor incorporating size-controlled, uniformly dispersed, directly patterned Bi2 O3 nanoparticles using the photochemical metal-organic deposition (PMOD) method
Summary
Miniaturization of electronic devices is the trend to manufacture ever smaller mechanical, electronic and optical products and devices. High density packaging, high performance and multifunction technologies have been developed as well [1,2]. Electronic devices that are reliable, smaller, and more faster than ever would need much improved electro energy storage devices. Several electronic devices and micro electro mechanical system (MEMS) require capacitors that show high performance. In order to apply electron energy storage device to these miniaturized devices, patterning technology must be possible and excellent dielectric properties of materials must be achieved [3,4]. By applying pattern to high dielectric materials, the device can be fabricated with more detail and density, making it suitable for miniaturization and high performance
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