Abstract
This paper presents a study of the growth of crack-like grain boundary voids undergoing a diffusive creep process. The voids are located on grain boundaries that are symmetric with respect to a grain boundary containing a semi-infinite macrocrack which is loaded by remote tension. A stress analysis of the grain boundary voids is performed and results for the stress distribution along the grain boundary, the void tip stress intensity factors are given. The transient growth of the voids by grain boundary diffusion is found to be described by an integro-differential equation, which is derived and solved numerically. All plastic deformations of the materials are neglected. The results of the transient diffusional analysis reveal the nature of the time-dependent stress distribution along the grain boundary and establish trends for the variation of the void extension rates with respect to time. The mechanism for macrocrack growth under diffusive creep conditions is discussed in light of the physical behavior suggested by the study.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
