Abstract
ABSTRACTIon implantation induced damage production in GaAs and InP is investigated using Rutherford backscattering spectrometry in combination with channeling techniques and near-edge optical measurements. 200 keV and 1.6 MeV Ar+ ions are implanted at room temperature in GaAs and InP with ion doses varying between 2 × 1012 cm−2 and 3 × 1015 cm−2. Our results show that InP behaves similar for the two implantation energies and no influence of energy loss in electronic processes is found. In GaAs in the region of maximum nuclear energy deposition almost no difference in the damage production occurs for the two implantation energies. But for 1.6 MeV Ar+ implantation within the first 500 nm the defect concentration is very low in comparison to the nuclear energy deposition, which may be the consequence of ionizationinduced defect annealing and/or of the fact that in this depth region the amount of nuclear energy deposition is less than a critical value being necessary for the production of heavily damaged and amorphous zones.
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