Abstract
High density polyethylene HDPE/SiO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> nanocomposites were prepared by melt compounding using a twin screw extruder. The thermal properties of the composites were investigated by differential scanning calorimetry (DSC). The microstructures of nanocomposites were characterized by scanning and transmission electron microscopy (SEM and TEM). The dielectric breakdown strength of the nanocomposites was investigated using AC progressive-stress tests at a rate of voltage increase of 500 V/s. The nanoscale structure seems to affect the both the electrical and the thermal properties of the HDPE composites.
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