Abstract
A method for measuring film adhesion is devised. It consists of a series of patterned film strips with different widths on a substrate, such that the driving force for each strip to debond increases as strip width increases when the system is subjected to residual and/or applied stresses. In this case, only those strips with sufficient driving force debond while the others remain attached to the substrate. Hence, qualitative comparison of the interface debond energy can be obtained by comparing the strip width below which debonding no longer occurs. By calculating the driving force for each strip to debond, the interface debond energy can be quantitatively determined.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
