Abstract
A reliability test device for measuring the torsional strength of anchors in micro electro-mechanical system (MEMS) devices was designed and fabricated by silicon-on-glass (SOG) process. The device consists of cantilever beam, array-shaped anchor and measuring scale. Torsional fracture tests were carried out on these devices with various anchor sizes. Utilizing the test results, the correlation between torsional strength and side length of anchor was obtained by the finite element analysis (FEA). The fracture morphology also revealed that the bonding strength of array-shaped anchor is much stronger than the ultimate strength of silicon and glass.
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