Development of vision system for defect inspection of electric parts in the tape and reel package

Abstract

Tape and reel packaging process is one of the important final manufacturing process of electric chip. During and after this packaging process, the defects of chips in the tape and reel package should be inspected. It is so time and cost consuming task by human inspectors. The main defects of chip in the tape and reel package are orientation chip, a wrong type chip and marking defects of chips. In this paper, the automatic vision system and image processing algorithms are developed to inspect the above defects on tape and reel packaging process. The high speed vision algorithm is based on multi-thread and parallel processing method to meet the inspection time(minimum 200 chips/min). Experiments were performed to evaluate the proposed vision inspection algorithms. The experimental result shows that our algorithm achieves high accuracy and speed for industrial requirement.