Abstract
A MEMS deformable mirror (DM) packaging process development effort is described. This development provides a path towards direct integration of future large actuator count optical MEMS arrays (> 4000) with underlying driver electronics. Characteristic features of the packaging process include creating electrical interconnection paths through the silicon wafer for each actuator, depositing gold bump bonds on the backside of the wafer, and fusing that array of bump bonds to an interposer substrate. This process differs from existing processes for MEMS arrays, which generally employ lithographically patterned wire-routing and peripheral wire bonding from the front surface of the MEMS array. In this article a feasibility experiment is described and successful results and process parameters are presented.
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