Abstract
AbstractThe development of the roughness of the Si (100) surface has been investigated at the initial stage of etching in the molecular flow of F2 and XeF2 gases. It was discovered that roughness grew during etching in XeF2 gas and decreased during etching in F2 gas, that is, F2 gas polishes Si surface unlike XeF2. This difference was explained with the help of ellipsometric study of the kinetics of adsorption layer formation.
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