Abstract
To meet the urgent market demand for small package size and high reliability performance for automotive CMOS image sensor (CIS) application, wafer level chip scale packaging (WLCSP) technology using through silicon vias (TSV) needs to be developed to replace current chip on board (COB) packages. In this paper, a WLCSP with the size of 5.82 mm × 5.22 mm and thickness of 850 μm was developed for the backside illumination (BSI) CIS chip using a 65 nm node with a size of 5.8 mm × 5.2 mm. The packaged product has 1392 × 976 pixels and a resolution of up to 60 frames per second with more than 120 dB dynamic range. The structure of the 3D package was designed and the key fabrication processes on a 12” inch wafer were investigated. More than 98% yield and excellent optical performance of the CIS package was achieved after process optimization. The final packages were qualified by AEC-Q100 Grade 2.
Highlights
With the innovation of commuting modes, the demand for the automotive electronic market is increasing explosively
Prior to the thermal humidity storage (THS), thermal humidity bias storage (THB) and temperature cycle (TC)-B test, samples need to be baked at 125 ◦ C for 24 h, soaked at 30 ◦ C under 60% relative humidity (RH) for 192 h and reflowed three times with a 260 ◦ C
The THB test at 85 ◦ C under 85% RH, THS test at 85 ◦ C under 85% RH, TC-B test (−55~125 ◦ C), high temperature storage (HTS) test at 125 ◦ C and low temperature storage (LTS) test at −40 ◦ C were performed
Summary
With the innovation of commuting modes, the demand for the automotive electronic market is increasing explosively. Cars are no longer the mechanical modes of transportation and entertainment and information centers connected with the external world by integration with advanced driver assistance systems (ADAS) [1,2,3,4]. The vision system, which is the key of the ADAS and enables the system for automatic emergency braking, autonomous driving, video mirror, rear view, 360-degree surround view and driver monitoring, benefits from the significant technological advancements of CMOS image sensor CIS [9,10,11,12]. With the development of CIS, it has become one of the most widely used sensors and gradually occupies more than 99% of the share in consumer electronics market [16,17]
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