Abstract
In the post COVID-19 virus era, online teaching and work from home have develop a common trends so the demand of electronic component rapidly increases. The development of lead-free solder has grown rapidly because various environmental legislations have enforced laws to restrict the use of Lead (Pb), Mercury (Hg) and Cadmium (Cd), etc because this is hazardous materials. In electronic and electrical industries. Many lead-free solder composition such as Sn - Bi, Sn - Cu, Sn - Zn, Sn - Ag, Zn - Bi, Sn – Ag - Cu, Sn – Zn - Bi, Sn – Cu - Bi, Sn – Cu - Ni etc. have been developed as a replacement of Sn - Pb solder. Researcher are facing challenges due to rise in melting temperature in lead-free solder (LFS) and the formation of intermetallic compound. This review paper aimed to summarise the thermal properties of lead free solders (LFS) and analyse the effect of addition of various elements and reinforcement in Sn based lead free solder (LFS).
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