Abstract
This paper deals with the development of a grinding wheel of resinoid segments with very fine SiC whiskers serving as the abrasive. The whiskers (diameter of about 1 μm, length of 40–50 μm) are directionally aligned and normal to the grinding surface. The alignment of the SiC whiskers and the surface roughness of the ground surfaces are examined. The results show that a smooth surface with a roughness value of R max = 0.04 μm (R 1 = 0.004 μm) is obtained for ground hardened die steel.
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