Detection of Defects by Identification of Thermal Contact Resistance

Abstract

With technological development, the use of electronic components has become indispensable. These circuits that invade our daily lives are present in all kinds of applications and in all areas of active life. These components have become much miniaturized and still undergo very high powers that can cause a detachment between the layers, reflecting the delamination phenomenon that can be modeled by thermal contact resistances. The present work is a study of the thermal contact resistance estimation in multilayer electronic structures using an approach based on the Levenberg–Marquardt method. The first part of the contribution focuses on the study of the impact of the Levenberg–Marquardt algorithm’s damping factor on the identification of the thermal contact resistance, or more precisely, the impact of the decay rate. The results show that a judicious choice of this parameter ensures very good precision and good convergence of identification. The second part is devoted to the study of the impact of the measurement sensor’s position in the structure on the identification. The results obtained are satisfactory. The cost function converges to the expected minimum and ensures a good identification of the thermal contact resistance, whether it is identical or different at the contact interface.