Design of Transient High Impact Multi-Typical Device Failure System

Abstract

The electronic components of the fuze circuit components fail under the extreme penetrating mechanics environment, and the circuit components and power supply modules fail, causing the fuze to misfire. Therefore, studying the failure mechanism of fuze circuit components and components during high impact is the key to ensuring the reliable function of the fuze. In addition, analyzing the failure mechanism of different components, optimizing the failure design of a single device, ensuring the normal function of the circuit and proposing different buffer protection measures to reduce the impact, provide support for the research on the fuze buffer protection. In order to study the failure characteristics of typical fuze devices under extreme mechanical environments, a multi-device failure analysis system suitable for laboratory high-speed impact tables and missile-loaded recovery tests is designed. The test system can realize typical devices including diodes, triodes, and operational amplifiers. Single-chip microcomputer, clock chip, voltage regulator chip, flash memory chip impact test simulation. It provides a failure analysis mechanism method for multiple devices in a high overload and strong impact environment, and at the same time, it realizes that the system provides multiple channel voltages, gets rid of the shackles of the previous external power supply, greatly reduces the volume of experimental equipment and test systems, and satisfies a variety of impact test devices and Missile recovery test. At the same time, corresponding buffer protection measures are designed according to different failure mechanisms, which provides reference for the research of fuze buffer protection.